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Aglomerado

O aglomerado de partículas - também por vezes referido como painel de partículas ou painel de fibras de baixa densidade - é fabricado através da mistura de pequenas partículas de madeira com resina epóxi.
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Chipboard

Descrição

Chipboard – also sometimes referred to as Particle Board or Low-Density Fibreboard – is made by mixing small wood particles with epoxy resin, which are pressed together under intense heat and pressure to produce a rigid board, typically with a smooth surface. Chipboard is available in a variety of densities to suit different needs and uses, including low, medium, and high-density varieties. The lower densities are fairly soft and pliable, while the higher-density chipboards are more rigid and can be used for more heavy-duty applications.

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Processo de produção

RAW MATERIAL PREPARATION

– Collect raw materials such as wood logs, sawmill residues, and recycled wood.
– Remove impurities (e.g., metal, stones) and debark the logs.
– Cut the materials into small chips (2-5cm in length) using chippers.

FIBER PRODUCTIONG

– Steam the wood chips in a digester at 160-180°C for 20-30 minutes to soften the lignin.
– Grind the softened chips into fine fibers using a defibrator (mechanical or thermal-mechanical process).

FIBER DRYING

– Dry the fibers in a rotary dryer to reduce moisture content to 8-12%.
– Separate and screen the dried fibers to remove oversize particles.

GLUING AND ADDITIVE APPLICATION

– Mix the fibers with synthetic resin (mainly urea-formaldehyde resin) at a ratio of 8-12% of fiber weight.
– Add wax emulsion (for water resistance) and curing agents as needed.
– Ensure uniform distribution of adhesives through a blending system.

MAT FORMING

– Convey the fiber-resin mixture to a forming machine.
– Form a continuous, uniform loose mat with controlled thickness and density.

PRE-PRESSING

– Compress the loose mat in a pre-press machine to reduce volume and improve stability.
– Form a semi-hardened slab for easier handling in subsequent processes.

HOT PRESSING

– Transfer the pre-pressed slab to a multi-layer hot press.
– Apply high temperature (180-220°C) and pressure (2.5-4 MPa) for 3-10 minutes.
– The heat cures the resin, and pressure bonds the fibers into a solid board.

COOLING AND TRIMMING

– Cool the hot-pressed boards to room temperature using cooling racks or fans.
– Trim the edges to achieve standard dimensions (e.g., 2440×1220mm) with saws.

SANDING

– Sand both surfaces of the boards using multi-head sanding machines.
– Achieve smoothness and precise thickness (typically 3-30mm).

QUALITY INSPECTION AND PACKING

– Inspect boards for defects (e.g., cracks, uneven density, surface imperfections).
– Grade the qualified boards based on quality standards.
– Stack and package the boards for storage or shipment.

Controlo de qualidade e embalagem

Temos um sistema persistente de inspeção pré-embarque. O processo de inspeção começa imediatamente após a confirmação da encomenda. O grau e o tipo de matéria-prima, os métodos de processamento, a inspeção e os detalhes da embalagem serão informados à direção da fábrica.
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Nossa fábrica e certificado

Temos um sistema persistente de inspeção pré-embarque. O processo de inspeção começa imediatamente após a confirmação da encomenda. O grau e o tipo de matéria-prima, os métodos de processamento, a inspeção e os detalhes da embalagem serão informados à direção da fábrica.
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