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Chipboard

Chipboard – also sometimes referred to as Particle Board or Low-Density Fibreboard – is made by mixing small wood particles with epoxy resin.
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Chipboard

Description

Chipboard – also sometimes referred to as Particle Board or Low-Density Fibreboard – is made by mixing small wood particles with epoxy resin, which are pressed together under intense heat and pressure to produce a rigid board, typically with a smooth surface. Chipboard is available in a variety of densities to suit different needs and uses, including low, medium, and high-density varieties. The lower densities are fairly soft and pliable, while the higher-density chipboards are more rigid and can be used for more heavy-duty applications.

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Processus de production

RAW MATERIAL PREPARATION

– Collect raw materials such as wood logs, sawmill residues, and recycled wood.
– Remove impurities (e.g., metal, stones) and debark the logs.
– Cut the materials into small chips (2-5cm in length) using chippers.

FIBER PRODUCTIONG

– Steam the wood chips in a digester at 160-180°C for 20-30 minutes to soften the lignin.
– Grind the softened chips into fine fibers using a defibrator (mechanical or thermal-mechanical process).

FIBER DRYING

– Dry the fibers in a rotary dryer to reduce moisture content to 8-12%.
– Separate and screen the dried fibers to remove oversize particles.

GLUING AND ADDITIVE APPLICATION

– Mix the fibers with synthetic resin (mainly urea-formaldehyde resin) at a ratio of 8-12% of fiber weight.
– Add wax emulsion (for water resistance) and curing agents as needed.
– Ensure uniform distribution of adhesives through a blending system.

MAT FORMING

– Convey the fiber-resin mixture to a forming machine.
– Form a continuous, uniform loose mat with controlled thickness and density.

PRE-PRESSING

– Compress the loose mat in a pre-press machine to reduce volume and improve stability.
– Form a semi-hardened slab for easier handling in subsequent processes.

HOT PRESSING

– Transfer the pre-pressed slab to a multi-layer hot press.
– Apply high temperature (180-220°C) and pressure (2.5-4 MPa) for 3-10 minutes.
– The heat cures the resin, and pressure bonds the fibers into a solid board.

COOLING AND TRIMMING

– Cool the hot-pressed boards to room temperature using cooling racks or fans.
– Trim the edges to achieve standard dimensions (e.g., 2440×1220mm) with saws.

SANDING

– Sand both surfaces of the boards using multi-head sanding machines.
– Achieve smoothness and precise thickness (typically 3-30mm).

QUALITY INSPECTION AND PACKING

– Inspect boards for defects (e.g., cracks, uneven density, surface imperfections).
– Grade the qualified boards based on quality standards.
– Stack and package the boards for storage or shipment.

Contrôle de la qualité et emballage

Nous disposons d'un système permanent d'inspection avant expédition. Le processus d'inspection commence immédiatement après la confirmation de la commande. La qualité et le type de matière première, les méthodes de traitement, les détails de l'inspection et de l'emballage seront communiqués à la direction de l'usine.
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Notre usine et notre certificat

Nous disposons d'un système permanent d'inspection avant expédition. Le processus d'inspection commence immédiatement après la confirmation de la commande. La qualité et le type de matière première, les méthodes de traitement, les détails de l'inspection et de l'emballage seront communiqués à la direction de l'usine.
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