Hollow Chipboard

설명
Hollow Chipboard is an engineered wood product made by pressing wood chips mixed with resin into panels. It features a lightweight hollow tubular core that balances strength and lightness, making installation easier. The hollow structure also brings good sound and heat insulation effects. It is widely used for door cores, lightweight furniture, and interior partitions.
생산 프로세스
원재료 준비
– Collect raw materials such as wood logs, sawmill residues, and recycled wood.
– Remove impurities (e.g., metal, stones) and debark the logs.
– Cut the materials into small chips (2-5cm in length) using chippers.
섬유 생산g
– Steam the wood chips in a digester at 160-180°C for 20-30 minutes to soften the lignin.
– Grind the softened chips into fine fibers using a defibrator (mechanical or thermal-mechanical process).
섬유 건조
– Dry the fibers in a rotary dryer to reduce moisture content to 8-12%.
– Separate and screen the dried fibers to remove oversize particles.
접착 및 첨가제 적용
– Mix the fibers with synthetic resin (mainly urea-formaldehyde resin) at a ratio of 8-12% of fiber weight.
– Add wax emulsion (for water resistance) and curing agents as needed.
– Ensure uniform distribution of adhesives through a blending system.
매트 성형
– Convey the fiber-resin mixture to a forming machine.
– Form a continuous, uniform loose mat with controlled thickness and density.
프리프레싱
– Compress the loose mat in a pre-press machine to reduce volume and improve stability.
– Form a semi-hardened slab for easier handling in subsequent processes.
핫 프레싱
– Transfer the pre-pressed slab to a multi-layer hot press.
– Apply high temperature (180-220°C) and pressure (2.5-4 MPa) for 3-10 minutes.
– The heat cures the resin, and pressure bonds the fibers into a solid board.
냉각 및 트리밍
– Cool the hot-pressed boards to room temperature using cooling racks or fans.
– Trim the edges to achieve standard dimensions (e.g., 2440×1220mm) with saws.
샌딩
– Sand both surfaces of the boards using multi-head sanding machines.
– Achieve smoothness and precise thickness (typically 3-30mm).
품질 검사 및 포장
– Inspect boards for defects (e.g., cracks, uneven density, surface imperfections).
– Grade the qualified boards based on quality standards.
– Stack and package the boards for storage or shipment.
품질 관리 및 포장








