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Hollow Chipboard

Hollow Chipboard is an engineered wood product made by pressing wood chips mixed with resin into panels.
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Hollow Chipboard

说明

Hollow Chipboard is an engineered wood product made by pressing wood chips mixed with resin into panels. It features a lightweight hollow tubular core that balances strength and lightness, making installation easier. The hollow structure also brings good sound and heat insulation effects. It is widely used for door cores, lightweight furniture, and interior partitions.

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生产流程

原料制备

– Collect raw materials such as wood logs, sawmill residues, and recycled wood.
– Remove impurities (e.g., metal, stones) and debark the logs.
– Cut the materials into small chips (2-5cm in length) using chippers.

纤维生产g

– Steam the wood chips in a digester at 160-180°C for 20-30 minutes to soften the lignin.
– Grind the softened chips into fine fibers using a defibrator (mechanical or thermal-mechanical process).

纤维干燥

– Dry the fibers in a rotary dryer to reduce moisture content to 8-12%.
– Separate and screen the dried fibers to remove oversize particles.

胶合和添加剂的应用

– Mix the fibers with synthetic resin (mainly urea-formaldehyde resin) at a ratio of 8-12% of fiber weight.
– Add wax emulsion (for water resistance) and curing agents as needed.
– Ensure uniform distribution of adhesives through a blending system.

垫层成型

– Convey the fiber-resin mixture to a forming machine.
– Form a continuous, uniform loose mat with controlled thickness and density.

预处理

– Compress the loose mat in a pre-press machine to reduce volume and improve stability.
– Form a semi-hardened slab for easier handling in subsequent processes.

热压

– Transfer the pre-pressed slab to a multi-layer hot press.
– Apply high temperature (180-220°C) and pressure (2.5-4 MPa) for 3-10 minutes.
– The heat cures the resin, and pressure bonds the fibers into a solid board.

冷却和修剪

– Cool the hot-pressed boards to room temperature using cooling racks or fans.
– Trim the edges to achieve standard dimensions (e.g., 2440×1220mm) with saws.

打磨

– Sand both surfaces of the boards using multi-head sanding machines.
– Achieve smoothness and precise thickness (typically 3-30mm).

质量检查和包装

– Inspect boards for defects (e.g., cracks, uneven density, surface imperfections).
– Grade the qualified boards based on quality standards.
– Stack and package the boards for storage or shipment.

质量控制和包装

我们有一套坚持不懈的装运前检验制度。订单确认后,检验过程立即开始。原材料的等级和类型、加工方法、检验和包装细节将告知工厂管理层。
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我们的工厂和证书

我们有一套坚持不懈的装运前检验制度。订单确认后,检验过程立即开始。原材料的等级和类型、加工方法、检验和包装细节将告知工厂管理层。
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